The Bergquist Company is the world’s leading developer and manufacturer of thermal management materials which include Sil-Pad®, thermally conductive insulators and various specialty materials; Gap Pad®, gap filling materials, Hi-Flow®, phase change materials, Softface® and Bond-Ply®. Bergquist also manufactures one and two layer Thermal Clad®, IMS® (Insulated Metal Substrate) Thermal Clad® HT and Thermal Clad®LTI, thermal management substrates for high power surface mount applications. Bergquist is the global source for the processing of Thermal Clad®, IMS® circuits.

THERMAL PAD TO-3 .009" SP600

THERMAL PAD TO-3 .009" SP600

THERMAL PAD TO-220 .009" SP600

THERMAL PAD TO-220 .009" SP600

THERMAL PAD DO-4 LARGE SP600

THERMAL PAD DO-5 LARGE SP600

THERMAL PAD SIP .009" SP600

THERMAL PAD TO-220 .009" SP600

THERMAL PAD TO-218 .009" SP600

THERMAL PAD TO-220 .009" SP600

THERMAL PAD TO-220 .009" SP600

THERMAL PAD TO-3 .006" K10

THERMAL PAD TO-3 .006" K10

THERMAL PAD TO-220 .006" K10

THERMAL PAD TO-220 .006" K10

THERMAL PAD DO-4 LARGE K10

THERMAL PAD DO-5 LARGE K10

THERMAL PAD SIP .006" K10

THERMAL PAD TO-220 .006" K10

THERMAL PAD TO-220 .006" K10
THERMAL PAD TO-247 .006" K10

THERM PAD TO-220 CLIP .006" K10

THERMAL PAD TO-3 .005" Q3

THERMAL PAD TO-3 .005" Q3

THERMAL PAD TO-220 .005" Q3

THERMAL PAD TO-220 .005" Q3

THERMAL PAD DO-4 LARGE Q3

THERMAL PAD DO-5 LARGE Q3

THERMAL PAD SIP .005" Q3

THERMAL PAD TO-220 .005" Q3

THERMAL PAD TO-220 .005" Q3

THERMAL PAD TO-247 .005" Q3

THERM PAD TO-220 CLIP .005" Q3

THERMAL PAD CPU .63"X.63"

THERM PAD CPU 1.375" X 1.375"

THERMAL PAD TO-220 .015" SP2000

THERM PAD POWER MOD .005" Q3

THERM PAD POWER MOD .005" Q3

THERM PAD PWR MOD W/ADH Q3

THERM PAD TO-3 4LEAD .009" SP600

THERM PAD TO-3 4LEAD .006" K10

THERMAL PAD TO-3 4LEAD .005" Q3

THERMAL PAD RECT .005" Q3

THERMAL PAD RECT .006" K10

THERMAL PAD RECT .005" Q3

THERMAL PAD RECT .006" K10

THERMAL PAD TO-220 .005" K10

THERMAL PAD TO-220 .005" Q3