573300D00010

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Specifications of 573300D00010

Type	Top Mount
Package Cooled	TO-263 (D²Pak)
Attachment Method	SMD Pad
Shape	Rectangular
Length	0.500" (12.70mm)
Width	1.030" (26.16mm)
Diameter	-
Height Off Base (Height of Fin)	0.400" (10.16mm)
Power Dissipation @ Temperature Rise	1.25W @ 30°C
Thermal Resistance @ Forced Air Flow	10.0°C/W @ 200 LFM
Thermal Resistance @ Natural	18°C/W
Material	Copper
Material Finish	Tin
Other Names	573300D00000 HS123CT
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