Part Number

28-526-11

Manufacturer

Description
CONN IC DIP SOCKET ZIF 28POS GLD
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors

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Specifications of 28-526-11
PackagingBulk
TypeDIP, ZIF (ZIP)
Number of Positions or Pins (Grid)28 (2 x 14)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating10µin (0.25µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesClosed Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostGold
Contact Finish Thickness - Post10µin (0.25µm)
Contact Material - PostBeryllium Copper
Housing MaterialPolyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature-55°C ~ 125°C
Termination Post Length0.105" (2.67mm)
Material Flammability RatingUL94 V-0
Current Rating3A
Contact Resistance-
Other Names28-526-11-ND
A850AR
Q824324
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