| Packaging | Bulk | |
| Type | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | |
| Number of Positions or Pins (Grid) | 28 (2 x 14) | |
| Pitch - Mating | 0.100" (2.54mm) | |
| Contact Finish - Mating | Nickel Boron | |
| Contact Finish Thickness - Mating | 50µin (1.27µm) | |
| Contact Material - Mating | Beryllium Nickel | |
| Mounting Type | Through Hole | |
| Features | Closed Frame | |
| Termination | Solder | |
| Pitch - Post | 0.100" (2.54mm) | |
| Contact Finish - Post | Nickel Boron | |
| Contact Finish Thickness - Post | 50µin (1.27µm) | |
| Contact Material - Post | Beryllium Nickel | |
| Housing Material | Polyetheretherketone (PEEK), Glass Filled | |
| Operating Temperature | -55°C ~ 250°C | |
| Termination Post Length | 0.110" (2.78mm) | |
| Material Flammability Rating | UL94 V-0 | |
| Current Rating | 1A | |
| Contact Resistance | - | |
| call me | [email protected] | |

CONN IC DIP SOCKET 24POS GOLD

CONN IC DIP SOCKET 18POS GOLD

CONN IC DIP SOCKET 24POS GOLD

CONN IC DIP SOCKET 14POS TIN

CONN SOCKET SIP 12POS TIN

CONN SOCKET SIP 20POS TIN

CONN SOCKET SIP 25POS TIN

CONN SOCKET SIP 34POS TIN

CONN SOCKET SIP 12POS TIN

CONN SOCKET SIP 20POS TIN

CONN SOCKET SIP 25POS TIN

CONN SOCKET SIP 34POS TIN