| Packaging | Tray | |
| Type | CLCC | |
| Number of Positions or Pins (Grid) | 68 (4 x 17) | |
| Pitch - Mating | 0.100" (2.54mm) | |
| Contact Finish - Mating | Gold | |
| Contact Finish Thickness - Mating | 30µin (0.76µm) | |
| Contact Material - Mating | Beryllium Copper | |
| Mounting Type | Through Hole | |
| Features | Closed Frame | |
| Termination | Solder | |
| Pitch - Post | 0.100" (2.54mm) | |
| Contact Finish - Post | Gold | |
| Contact Finish Thickness - Post | 30µin (0.76µm) | |
| Contact Material - Post | Beryllium Copper | |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled | |
| Operating Temperature | -55°C ~ 105°C | |
| Termination Post Length | 0.100" (2.54mm) | |
| Material Flammability Rating | UL94 V-0 | |
| Current Rating | 1A | |
| Contact Resistance | - | |
| Other Names | 2006805400-064011002 2685401521102JH 3M6809D 5113869805 51138698058 5400789953 54007899532 80-6102-8822-9 80610288229 JE-1501-7720-0 JE150177200 | |
| call me | [email protected] | |

CONN IC DIP SOCKET 24POS GOLD

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