Packaging | Bulk | |
Type | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | |
Number of Positions or Pins (Grid) | 24 (2 x 12) | |
Pitch - Mating | 0.100" (2.54mm) | |
Contact Finish - Mating | Nickel Boron | |
Contact Finish Thickness - Mating | 50µin (1.27µm) | |
Contact Material - Mating | Beryllium Nickel | |
Mounting Type | Through Hole | |
Features | Closed Frame | |
Termination | Solder | |
Pitch - Post | 0.100" (2.54mm) | |
Contact Finish - Post | Nickel Boron | |
Contact Finish Thickness - Post | 50µin (1.27µm) | |
Contact Material - Post | Beryllium Nickel | |
Housing Material | Polyetheretherketone (PEEK), Glass Filled | |
Operating Temperature | -55°C ~ 250°C | |
Termination Post Length | 0.110" (2.78mm) | |
Material Flammability Rating | UL94 V-0 | |
Current Rating | 1A | |
Contact Resistance | - | |
call me | [email protected] |
CONN IC DIP SOCKET 24POS GOLD
CONN IC DIP SOCKET 18POS GOLD
CONN IC DIP SOCKET 24POS GOLD
CONN IC DIP SOCKET 14POS TIN
CONN SOCKET SIP 12POS TIN
CONN SOCKET SIP 20POS TIN
CONN SOCKET SIP 25POS TIN
CONN SOCKET SIP 34POS TIN
CONN SOCKET SIP 12POS TIN
CONN SOCKET SIP 20POS TIN
CONN SOCKET SIP 25POS TIN
CONN SOCKET SIP 34POS TIN