| Packaging | Bulk | |
| Type | SOIC | |
| Number of Positions or Pins (Grid) | 20 (2 x 10) | |
| Pitch - Mating | - | |
| Contact Finish - Mating | Gold | |
| Contact Finish Thickness - Mating | - | |
| Contact Material - Mating | Beryllium Copper | |
| Mounting Type | Through Hole | |
| Features | Closed Frame | |
| Termination | Solder | |
| Pitch - Post | - | |
| Contact Finish - Post | Gold | |
| Contact Finish Thickness - Post | 30µin (0.76µm) | |
| Contact Material - Post | Beryllium Copper | |
| Housing Material | Polyethersulfone (PES), Glass Filled | |
| Operating Temperature | -55°C ~ 150°C | |
| Termination Post Length | 0.140" (3.56mm) | |
| Material Flammability Rating | UL94 V-0 | |
| Current Rating | 1A | |
| Contact Resistance | - | |
| Other Names | 0 51138 69618 4 2.2072E+12 2207201551902 3M5057 5113869618 51138696184 JE150900874 | |
| call me | [email protected] | |

CONN IC DIP SOCKET 24POS GOLD

CONN IC DIP SOCKET 18POS GOLD

CONN IC DIP SOCKET 24POS GOLD

CONN IC DIP SOCKET 14POS TIN

CONN SOCKET SIP 12POS TIN

CONN SOCKET SIP 20POS TIN

CONN SOCKET SIP 25POS TIN

CONN SOCKET SIP 34POS TIN

CONN SOCKET SIP 12POS TIN

CONN SOCKET SIP 20POS TIN

CONN SOCKET SIP 25POS TIN

CONN SOCKET SIP 34POS TIN