| Packaging | Bulk | |
| Type | QFN | |
| Number of Positions or Pins (Grid) | 16 (4 x 4) | |
| Pitch - Mating | 0.020" (0.50mm) | |
| Contact Finish - Mating | Gold | |
| Contact Finish Thickness - Mating | - | |
| Contact Material - Mating | Beryllium Copper | |
| Mounting Type | Through Hole | |
| Features | - | |
| Termination | Solder | |
| Pitch - Post | - | |
| Contact Finish - Post | Gold | |
| Contact Finish Thickness - Post | - | |
| Contact Material - Post | Beryllium Copper | |
| Housing Material | Polyethersulfone (PES) | |
| Operating Temperature | - | |
| Termination Post Length | 0.118" (3.00mm) | |
| Material Flammability Rating | - | |
| Current Rating | - | |
| Contact Resistance | 25 mOhm | |
| Other Names | 216520501 3M10832 5111560211 51115602115 80001385782 | |
| call me | [email protected] | |

CONN IC DIP SOCKET 24POS GOLD

CONN IC DIP SOCKET 18POS GOLD

CONN IC DIP SOCKET 24POS GOLD

CONN IC DIP SOCKET 14POS TIN

CONN SOCKET SIP 12POS TIN

CONN SOCKET SIP 20POS TIN

CONN SOCKET SIP 25POS TIN

CONN SOCKET SIP 34POS TIN

CONN SOCKET SIP 12POS TIN

CONN SOCKET SIP 20POS TIN

CONN SOCKET SIP 25POS TIN

CONN SOCKET SIP 34POS TIN