208-7391-55-1902

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Specifications of 208-7391-55-1902

Packaging	Bulk
Type	SOIC
Number of Positions or Pins (Grid)	8 (2 x 4)
Pitch - Mating	-
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	30µin (0.76µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	-
Contact Finish - Post	Gold
Contact Finish Thickness - Post	30µin (0.76µm)
Contact Material - Post	Beryllium Copper
Housing Material	Polyethersulfone (PES), Glass Filled
Operating Temperature	-55°C ~ 150°C
Termination Post Length	0.140" (3.56mm)
Material Flammability Rating	UL94 V-0
Current Rating	1A
Contact Resistance	-
Other Names	0 51138 69621 4 2.08739E+12 2087391551902 3M5054 5113869621 51138696214 JE150900825
call me	[email protected]

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