163-PLS15064-12

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Specifications of 163-PLS15064-12

Packaging	Bulk
Type	PGA, ZIF (ZIP)
Number of Positions or Pins (Grid)	-
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	30µin (0.76µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin
Contact Finish Thickness - Post	200µin (5.08µm)
Contact Material - Post	Beryllium Copper
Housing Material	Polyphenylene Sulfide (PPS)
Operating Temperature	-65°C ~ 125°C
Termination Post Length	0.125" (3.18mm)
Material Flammability Rating	UL94 V-0
Current Rating	1A
Contact Resistance	-
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