Packaging | Bulk | |
Type | PGA, ZIF (ZIP) | |
Number of Positions or Pins (Grid) | - | |
Pitch - Mating | 0.100" (2.54mm) | |
Contact Finish - Mating | Gold | |
Contact Finish Thickness - Mating | 30µin (0.76µm) | |
Contact Material - Mating | Beryllium Copper | |
Mounting Type | Through Hole | |
Features | Closed Frame | |
Termination | Solder | |
Pitch - Post | 0.100" (2.54mm) | |
Contact Finish - Post | Tin | |
Contact Finish Thickness - Post | 200µin (5.08µm) | |
Contact Material - Post | Beryllium Copper | |
Housing Material | Polyphenylene Sulfide (PPS) | |
Operating Temperature | -65°C ~ 125°C | |
Termination Post Length | 0.125" (3.18mm) | |
Material Flammability Rating | UL94 V-0 | |
Current Rating | 1A | |
Contact Resistance | - | |
call me | [email protected] |
CONN IC DIP SOCKET 24POS GOLD
CONN IC DIP SOCKET 18POS GOLD
CONN IC DIP SOCKET 24POS GOLD
CONN IC DIP SOCKET 14POS TIN
CONN SOCKET SIP 12POS TIN
CONN SOCKET SIP 20POS TIN
CONN SOCKET SIP 25POS TIN
CONN SOCKET SIP 34POS TIN
CONN SOCKET SIP 12POS TIN
CONN SOCKET SIP 20POS TIN
CONN SOCKET SIP 25POS TIN
CONN SOCKET SIP 34POS TIN